P/N: YZPST-BT145-800R
DESRCRIPTION:
Planar passivated
Silicon Controlled Rectifier (SCR) in a TO220
Plastic Package intended for use in applications requiring high bidirectional blocking voltage capability, high current inrush capability and high thermal cycling performance.
Features and benefits
AC power control
High bidirectional blocking voltage capability
High thermal cycling performance
Planar passivated for voltage ruggedness and reliability
High junction operating temperature capability (Tj(max) = 150 °C)
Package meets UL94V0 flammability requirement
Package is RoHS compliant
IEC 61000-4-4 fast transien
Applications
Capacitive Discharge Ignition (CDI)
Crowbar protection
Inrush protection
Motor control
Voltage regulation
High junction operating temperature capability (Tj(max) = 150 °C)
Quick reference data
Symbol | Parameter | Conditions | | Min | Typ | Max | Unit |
Absolute maximum rating |
VRRM | repetitive peak reverse voltage | | | - | - | 800 | V |
IT(RMS) | RMS on-state current | half sine wave; Tmb ≤ 128 °C; | | - | - | 25 | A |
Fig. 1; Fig. 2; Fig. 3 |
ITSM | non-repetitive peak on- state current | half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 | | - | - | 300 | A |
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms | | - | - | 330 | A |
Tj | junction temperature | | | - | - | 150 | °C |
Symbol | Parameter | Conditions | | Min | Typ | Max | Unit |
Static characteristics |
IGT | gate trigger current | VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 7 | | 1.5 | - | 15 | mA |
IH | holding current | VD = 12 V; Tj = 25 °C; Fig. 9 | | - | - | 60 | mA |
VT | on-state voltage | IT = 30 A; Tj = 25 °C; Fig. 10 | | - | 1.1 | 1.5 | V |
Dynamic characteristics |
dVD/dt | rate of rise of off-state voltage | VDM = 536 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit | | 80 | - | - | V/μs |
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol | Parameter | Conditions | | Min | Max | Unit |
VDRM | repetitive peak off-state voltage | | | - | 800 | V |
VRRM | repetitive peak reverse voltage | | | - | 800 | V |
IT(AV) | average on-state current | half sine wave; Tmb ≤ 128°C; | | - | 16 | A |
IT(RMS) | RMS on-state current | half sine wave; Tmb ≤ 128°C; Fig. 1; Fig. 2; Fig. 3 | | - | 25 | A |
ITSM | non-repetitive peak on- state current | half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 | | - | 300 | A |
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms | | - | 330 | A |
I2t | I2t for fusing | tp = 10 ms; SIN | | - | 450 | A2s |
d IT/dt | rate of rise of on-state current | IG = 20 mA | | - | 200 | A/μs |
IGM | peak gate current | | | - | 5 | A |
VRGM | peak reverse gate | | | - | 5 | V |
voltage |
PGM | peak gate power | | | - | 20 | W |
PG(AV) | average gate power | over any 20 ms period | | - | 0.5 | W |
Tstg | storage temperature | | | -40 | 150 | °C |
Tj | junction temperature | | | - | 150 | °C |
Thermal Characteristics
Symbol | Parameter | Conditions | | Min | Typ | Max | Unit |
Rth(j-mb) | thermal resistance | Fig. 6 | | - | - | 1 | K/W |
from junction to |
mounting base |
Rth(j-a) | thermal resistance | in free air | | - | 60 | - | K/W |
from junction to |
ambient free air |